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Rao Tummala

McGraw-Hill Professional

2008-4-15

785

USD 125.00

Hardcover

9780071459068

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发表于2024-11-05

System on Package epub 下载 mobi 下载 pdf 下载 txt 电子书下载 2024

System on Package pdf epub mobi txt 电子书下载 2024

图书描述

"System-on-Package" (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

System on Package 下载 mobi epub pdf txt 电子书