圖書標籤:
发表于2024-11-09
Area Array Package Design pdf epub mobi txt 電子書 下載 2024
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Packag
評分
評分
評分
評分
Area Array Package Design pdf epub mobi txt 電子書 下載 2024