图书标签:
发表于2024-12-27
Area Array Package Design pdf epub mobi txt 电子书 下载 2024
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Packag
评分
评分
评分
评分
Area Array Package Design pdf epub mobi txt 电子书 下载 2024