Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues pdf epub mobi txt 电子书下载 2024

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Calif.) Chemical-Mechanical Polishing 200 (2000 San Francisco

Materials Research Society

2001-05

161

USD 48.00

Hardcover

9781558995215

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发表于2024-09-20

Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues epub 下载 mobi 下载 pdf 下载 txt 电子书下载 2024

Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues pdf epub mobi txt 电子书下载 2024

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Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This volume provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.

Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues 下载 mobi epub pdf txt 电子书