Solder Joint Reliability Prediction for Multiple Environments pdf epub mobi txt 電子書下載 2024

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Perkins, Andrew Eugene

2008-10

212

$ 168.37

9780387793931

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发表于2024-09-21

Solder Joint Reliability Prediction for Multiple Environments epub 下載 mobi 下載 pdf 下載 txt 電子書下載 2024

Solder Joint Reliability Prediction for Multiple Environments pdf epub mobi txt 電子書下載 2024

圖書描述

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Solder Joint Reliability Prediction for Multiple Environments 下載 mobi epub pdf txt 電子書