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发表于2024-12-04
Fabrication, Packaging and Integration of MEMS and Related Microsystems pdf epub mobi txt 电子书 下载 2024
This is the first book dedicated to packaging and integration of MEMS and related Microsystems. While packaging was once considered secondary, it has now developed its own standards throughout the world. The book discusses the three key features for next generation application specific systems-on-a-chip (SOC): Mixed Signals, Mixed Environmental Domains, and Varying Scales of Devices and Packaging Components.
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Fabrication, Packaging and Integration of MEMS and Related Microsystems pdf epub mobi txt 电子书 下载 2024