Chip Design for Non-designers pdf epub mobi txt 电子书 下载 2024


Chip Design for Non-designers

简体网页||繁体网页
Carballo, Juan-Antonio
PennWell Corp.
2008-3-27
178
USD 79.00
9781593701062

图书标签: 英文原版  IC   


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发表于2024-11-04

Chip Design for Non-designers epub 下载 mobi 下载 pdf 下载 txt 电子书 下载 2024

Chip Design for Non-designers epub 下载 mobi 下载 pdf 下载 txt 电子书 下载 2024

Chip Design for Non-designers pdf epub mobi txt 电子书 下载 2024



图书描述

Product Description

Chip Design for Non-Designers: An Introduction provides a practical introduction to modern chip design methodologies. It is intended for manufacturing-oriented and other non-design professionals with an interest in the pre-tape-out design side. The book concentrates on functional, logic, circuit, and layout design using state-of-the-art methods and tools. More focus is given to the most popular design styles, including semi-custom design. Many practical and useful examples are included throughout.

Features & benefits: This book will provide readers with working knowledge of modern chip design methodologies. The examples, exercises, and bibliographical references included provide an excellent guide towards a direct use of the concepts learned. Readers will become truly fluent with how one designs modern chips for many varied applications.

Chip Design for Non-designers 下载 mobi epub pdf txt 电子书

著者简介

About the Author

Juan-Antonio Carballo, Ph.D. has extensive technical and business experience in semiconductor, chip design, and hardware system design, working at institutions such as Digital Equipment Corporation, LSI Logic Corporation, IBM Research, IBM Venture Capital, and Argon Venture Partners. Dr. Carballo’s leadership at IBM Research helped produce new power-efficient adaptive communication chips and systems. He was named Number 1 in the "Top 40 Under 40" list by American Venture Magazine in 2006. He has 23 patent filings in chip and hardware design, and has published more than 50 articles in various publications. Dr. Carballo holds a Ph.D. in Electrical Engineering from the University of Michigan in chip design, an MBA from the College des Ingenieurs (Paris) and an M.Sc. in Telecommunications Engineering from UPM (Madrid).


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