Handbook of 3D Integration pdf epub mobi txt 电子书下载 2024

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Philip Garrou

2008-10

798

$ 285.00

9783527320349

图书标签: 集成电路三维封装

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发表于2024-08-02

Handbook of 3D Integration epub 下载 mobi 下载 pdf 下载 txt 电子书下载 2024

Handbook of 3D Integration pdf epub mobi txt 电子书下载 2024

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two–volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA–LETI, IBM, and Renesas.

Handbook of 3D Integration 下载 mobi epub pdf txt 电子书