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出版者:Society of Photo Optical

作者:Righini, Giancarlo C. (EDT)/ Najafi, S. Iraj (EDT)/ Society of Photo-Optical Instrumentation Enginee

出品人:

页数:398

译者:

出版时间:

价格:105

装帧:Pap

isbn号码:9780819430908

丛书系列:

图书标签:

• 光集成
• 集成光学
• 光子器件
• 光学器件
• 微光子学
• 硅光子学
• 波导
• 光调制
• 光检测
• 光学通信

Integrated Optics Devices III: A Deep Dive into Advanced Waveguide Technologies and Nonlinear Applications This volume continues the exploration of the rapidly evolving field of integrated optics, focusing specifically on the cutting edge of waveguide design, advanced material integration, and the implementation of complex photonic circuits for novel functionalities. While Integrated Optics Devices III specifically addresses methodologies for enhancing light confinement, manipulation, and nonlinear interaction within planar and three-dimensional structures, this summary will detail related, yet distinct, areas of integrated photonics that this book does not extensively cover, allowing for a clear delineation of its unique focus. Areas of Focus Outside the Scope of Integrated Optics Devices III Integrated Optics Devices III primarily concentrates on the physical realization and characterization of high-confinement waveguides (such as slot waveguides, subwavelength grating structures, and index-contrast-dominated silicon photonics platforms) and their application in active and passive components, especially those leveraging Kerr non-linearities. Therefore, the following related fields, crucial to the broader landscape of integrated photonics, receive only peripheral or introductory mention, serving mainly as context rather than core content: 1. Large-Scale Optical Interconnects and Data Centers: While the book discusses the fundamental building blocks (like modulators and couplers) necessary for interconnects, it does not delve deeply into the architectural design, packaging challenges, or system-level integration of massive optical switching matrices required for modern, high-density data centers. Topics such as chip-to-chip, board-to-board, and rack-to-rack optical transmission standards (e.g., OIF or IEEE specifications), large-scale thermal management strategies for dense 2D arrays of photonic integrated circuits (PICs), or the specific trade-offs involved in developing CMOS-compatible, low-power optical transceivers operating at speeds exceeding 400 Gb/s per channel are beyond its primary scope. The book focuses more on the physics of the individual nonlinear element rather than the system engineering required to deploy thousands of such elements. 2. Bio-Sensing and Lab-on-a-Chip (LOC) Systems: The principles of sensing enhancement through high confinement are touched upon when discussing waveguide sensing layers. However, the dedicated engineering challenges and biological applications inherent to fully integrated biosensor platforms are largely excluded. This includes detailed discussions on surface functionalization techniques necessary for specific molecular recognition (e.g., covalent bonding protocols for proteins), microfluidic integration methods (bonding, patterning, and flow control within PICs), and the validation protocols (e.g., limits of detection, specificity assays) required for clinical or environmental monitoring applications. The book emphasizes electro-optic effects and nonlinear frequency conversion rather than biological interaction cross-sections. 3. Quantum Photonics Hardware (Excluding Photon-Photon Interaction Nonlinearity): A significant area often intersecting with integrated optics is the creation of on-chip quantum light sources and detectors. Integrated Optics Devices III may discuss using nonlinear materials for frequency mixing (a classical process), but it generally avoids the specialized realm of true quantum optics engineering. This exclusion means the book does not cover: Single-Photon Sources: Detailed fabrication and characterization of quantum dots or color centers embedded within waveguides for deterministic single-photon generation. Entangled Photon Sources: Analysis of spontaneous parametric down-conversion (SPDC) or spontaneous four-wave mixing (SFWM) optimized purely for maximizing coincidence counts and minimizing multi-photon components, often requiring specific thermal stabilization far beyond typical telecommunications PIC operation. Superconducting Nanowire Single-Photon Detectors (SNSPDs): The integration of these cryogenic detectors onto PICs, which presents unique thermal and electrical isolation challenges not central to the discussion of passive or electro-optic components in the main text. 4. Advanced III-V Heterogeneous Integration Platforms (Specific Epitaxy and Material Growth): While silicon photonics often dominates the discussion due to its scalability, the book recognizes the need for active gain components, often achieved by bonding or wafer-bonding III-V materials (like InP or GaAs) to silicon substrates. However, the intense focus within Integrated Optics Devices III is typically on the device physics once the heterogeneous structure is formed (e.g., how the gain coupling affects the nonlinear interaction). It does not offer a comprehensive review of the semiconductor physics or epitaxial growth techniques themselves, such as: MOCVD/MBE Optimization: Detailed parameters for growing quantum wells or heterostructures tailored for specific gain wavelengths (e.g., 1310 nm vs. 1550 nm). Defect Engineering in Bonded Interfaces: Methods for minimizing threading dislocations and managing strain accumulation at the critical wafer interface, which heavily influence long-term device reliability but are peripheral to the nonlinear wave mechanics discussed. 5. High-Power Laser Systems and Bulk Optics Analogs: The core expertise of this book lies in miniaturization and integration onto a chip. Consequently, it minimizes discussion on high-power applications that still rely heavily on traditional bulk optics or fiber laser architectures. This omits detailed treatment of: Mode-Locking Regimes in Fiber Lasers: Techniques for generating femtosecond pulses in large-core or large-mode-area fibers, where thermal management is handled by external cooling rather than on-chip thermal tuning. Optical Parametric Amplification (OPA) in Bulk Crystals: While the book discusses on-chip OPAs, it does not explore the scaling laws, stability considerations, or ultra-broadband capabilities achieved using traditional, large-aperture PPLN or periodically poled lithium niobate (PPLN) bulk crystals pumped by high-energy sources. In summary, Integrated Optics Devices III serves as an advanced guide to manipulating light confinement and exploiting intrinsic material nonlinearities within scalable, integrated frameworks, particularly silicon and related high-index contrast platforms. It consciously sets aside the system-level integration, biological interfacing, quantum mechanics, and specialized semiconductor fabrication required for deploying these components in wider technological ecosystems.

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