具体描述
内容简介
市面上虽然已有许多关于数字集成电路设计的书籍，但
绝大部分都是孤立地讨论“数字系统”、或“数字电路单元”、
或“设计方法”。而本书则将系统、电路和设计方法这三者
有机地结合起来，深入地讨论了CMOS、双极型和砷化镓
（GaAS）数字集成电路。本书在详细介绍集成电路的器件模型
和墓本单元电路的基础上，系统地介绍了数字集成电路系统
设计中的四类关键技术：运算单元设计、时序组织与规划、
存储单元、互连线与寄生效应，是一本内容丰富，且特别
适合于深亚微米数字集成电路设计的优秀教材。
好的，下面为您提供一个关于“数字集成电路——设计透视”的图书简介，内容详实，旨在提供一个全面且深入的视角，而非具体介绍您提到的那本书的内容。 --- 图书简介：现代数字系统设计与实现的核心洞察 导言：在微观与宏观之间架设桥梁 在当今信息技术飞速发展的时代，数字集成电路（Digital Integrated Circuits）已成为驱动技术创新的核心引擎。从智能手机到超级计算机，从物联网设备到人工智能加速器，每一项前沿技术的实现都离不开对底层数字电路的精妙设计与高效制造。然而，数字集成电路的设计绝非仅仅是逻辑门和晶体管的堆砌，它是一门集成了物理学、材料科学、电子工程、计算机科学乃至系统架构学的复杂交叉学科。 本书旨在为读者提供一个超越基础概念的、更为深入和全面的视角，聚焦于现代数字集成电路设计与实现过程中的关键挑战、主流方法论以及未来发展趋势。我们不局限于单一的设计流程或技术节点，而是力求展现一个宏观的蓝图，揭示从算法到芯片的转化过程中，工程师们需要权衡的各个维度。 第一部分：数字系统设计的基石与架构演进 本部分首先回顾数字电路设计的理论基础，但重点在于如何将这些基础知识应用于复杂系统的构建。我们将探讨组合逻辑与时序逻辑设计中的高级技巧，特别是如何应对亚稳态、毛刺（glitches）以及时序违例等实际问题。 系统级抽象与建模： 深入分析如何使用硬件描述语言（如VHDL与Verilog）进行系统级建模。强调高层次综合（High-Level Synthesis, HLS）在加速设计迭代中的作用，以及如何有效地将算法级的描述转化为可综合的RTL代码。 时序分析与约束管理： 时序是数字设计的生命线。本部分将详细阐述静态时序分析（STA）的原理与实践，包括如何设定精确的物理与逻辑约束，以及如何处理片上延迟变化的挑战。我们将讨论先进的时钟树综合（CTS）技术，及其对全局时序收敛的决定性影响。 功耗敏感设计范式： 随着集成密度的增加和移动计算的兴起，功耗已成为与性能和面积同等重要的设计指标。我们探讨从架构级、算法级、逻辑门级到晶体管级的多层级低功耗设计策略，包括时钟门控（Clock Gating）、电源门控（Power Gating）以及动态电压与频率调节（DVFS）的技术细节。 第二部分：物理实现与工艺的深刻关联 集成电路的设计成果最终依赖于其在硅片上的物理实现。本部分将侧重于设计决策如何被物理约束所形塑，以及如何应对先进制造工艺带来的独特挑战。 布局规划与布线策略： 深入分析标准单元库的特性及其对布局的影响。重点讨论全局布线、详细布线中的拥塞（Congestion）管理技术，以及如何优化电源/地（Power/Ground）网络的完整性，以应对IR Drop问题。 先进工艺节点的挑战： 随着技术节点进入深亚微米甚至纳米级别，互连延迟、亚阈值泄漏以及制造变异性（Process Variation）的影响日益显著。本部分将讨论设计流程如何适应这些变化，例如采用近阈值电压设计（Near-Threshold Computing）和寄生参数提取的复杂性。 可靠性与可测试性设计（DFT）： 芯片的可靠性是商业成功的基础。我们将详细介绍内置自测试（BIST）结构，如扫描链（Scan Chains）的插入与优化，以及如何通过边界扫描技术确保大规模集成电路的生产测试覆盖率。同时，探讨对瞬态错误（如软错误）的防御机制。 第三部分：性能优化与新兴设计范式 现代数字系统往往追求极致的性能与能效比。本部分关注超越传统同步设计的优化手段，以及面向未来应用的全新设计思路。 异步与自适应电路设计： 探讨摆脱全局时钟的异步设计方法，分析其在消除时钟偏斜和降低功耗方面的潜在优势，以及其在系统集成中面临的握手协议复杂性。 并行化与数据流架构： 深入分析大规模并行处理（MPP）架构，如流式处理器和数据流驱动架构的设计原则。讨论如何有效划分任务、管理片上通信带宽，以充分发挥并行计算的潜力。 特定领域架构（DSA）的设计哲学： 阐述通用计算架构（如CPU）向专用加速器（如GPU、TPU等）演进的驱动力。重点分析如何根据应用需求（如深度学习、信号处理）来定制硬件数据路径、存储层次结构和互连拓扑，以实现数量级的效率提升。 展望未来：智能与异构集成 最后，本书将展望数字集成电路设计的前沿领域，包括先进封装技术（如2.5D/3D集成）如何重塑系统级设计，以及机器学习在EDA工具链中的融合应用，预示着设计工程师未来工作方式的深刻变革。 目标读者 本书适合有志于深入理解现代数字集成电路设计流程的高年级本科生、研究生、以及从事ASIC/SoC设计、验证和物理实现工作的工程师。它不仅提供了设计方法的“如何做”，更深入剖析了不同设计选择背后的“为什么”，是构建强大数字系统设计知识体系的有力参考。 ---
作者简介
目录信息
CONTENTS
Chapterl: Introduction
1.1 A Historical Perspective
1.2 Issues in Digital Integrated Circuit Design
1.3 To Probe Further
1.4 Exercises
PART 1: A CIRCUIT PERSPECTIVE
Chapter 2: The Devices
2.1 Introduction
2.2 The Diode
2.2.1 A First Glance at the Device
2.2.2 Static Behavior
2.2.3 Dynamic, or Transient, Behavior
2.2.4 The Actual Diode-Secondary Effects
2.2.5 The SPICE Diode Model
2.3 The MOS(FET) Transistor
2.3.1 A First Glance at the Device
2.3.2 Static Behavior
2.3.3 Dynamic Behavior
2.3.4 The Actual MOS Transistor-Secondary Effects
2.3.5 SPICE Models for the MOS Transistor
2.4 The Bipolar Transistor
2.4.1 A First Glance at the Device
2.4.2 Stalic Behavior
2.4.3 Dynamic Behavior
2.4.4 The Actual Bipolar Transistor-Secondary Effects
2.4.5 SPICE Models for the Bipolar Transistor
2.5 A Word on Process Variations
2.6 Perspective: Future Device Developments
2.7 Summary
2.8 To Probe Further
2.9 Exercises and Design Problems
Appendlx A: Layout Design Rules
Appendlx B: Small-Slgnal Models
Chapter 3: The Inverter
3.1 Introduction
3.2 Delinitions and Properties
3.2.1 Area and Complexity
3.2.2 Functionality and Robustness: The Static Behavior
3.2.3 Performance: The Dynamic Behavior
3.2.4 Power and Energy Consumption
3.3 The Static CMOS Invener
3.3.1 A First Glance
3.3.2 Evaluating the Robustness of the CMOS Inverter: The Static Behavior
3.3.3 Perfonnance of CMOS Inverter: The Dynamic Behavior
3.3.4 Power Consumption and Power-Delay Product
3.3.5 A Look into the Future: Effects of Technology Scaling
3.4 The Bipolar ECL Inverter
3.4.1 Issues in Bipolar Digital Design: A Case Study
3.4.2 The Emitter-Coupled Logic (ECL) Gate at a Glance
3.4.3 Robustness and Noise Immunity: The Steady-State Characteristics
3.4.4 ECL Switching Speed: Thc Transient Behavior
3.4.5 Power Consumption
3.4.6 Looking Ahead: Scaling the Technology
3.5 Perspective: Area, Perfonnance, and Dissipation
3.6 Summary
3.7 To Probe Further
3.8 Exercises and Design Problems
Chapter 4: Designing Combinational Logk Cates in CMOS
4.1 Introduction
4.2 Static CMOS Design
4.2.1 Complementary CMOS
4.2.2 Ratioed Logic
4.2.3 Pass-Transistor Logic
4.3 Dynamic CMOS Design
4.3.1 Dynamic Logic: Basic Principles
4.3.2 Perfonnance of Dynamic Logic
4.3.3 Noise Considerations in Dynamic Design
4.3.4 Cascading Dynamic Gates
4.4 Power Consumption in CMOS Gates
4.4.1 Switching Activity of a Logic Gate
4.4.2 Glitching in Static CMOS Circuits
4.4.3 Short-Circuit Currents in Static CMOS Circuits
4.4.4 Analyzing Power Consumption Using SPICE
4.4.5 Low-Power CMOS Design
4.5 Perspective: How to Choose a Logic Style
4.6 Summary
4.7 To Probe Further
4.8 Exercises and Design Problems
Appendix C: Layout Techniques for Complex Cates
Chapter 5: Very High Perfonnance Digital Circuits
5.1 Introduction
5.2 Bipolar Gate Design
5.2.1 Logic Design in ECL
5.2.2 Differential ECL
5.2.3 Current Mode Logic
5:2.4 ECL with Active Pull-Downs
5.2.5 Altemative Bipolar Logic Styles
5.3 The BiCMOS Approach
5.3.1 The BiCMOS Gate at a Glance
5.3.2 The Static Behavior and Robustness Issues
5.3.3 Perfonnance of the BiCMOS Inverter
5.3.4 Power Consumption
5.3.5 Technology Scaling
5.3.6 Designing BiCMOS Digital Gates
5.4 Digital Gallium Arsenide Design *
5.4.1 GaAs Devices and Their Properties
5.4.2 GaAs Digital Circuit Design
5.5 Low-Temperature Digital Circuits *
5.5.1 Low-Temperature Silicon Digital Circuits
5.5.2 Superconducting Logic Circuits
5.6 Perspective: When to Use High-Performance Technologies
5.7 Summary
5.8 To Probe Further
5.9 Exercises and Design Problems
Appendlx D: The Schottky-Bamer Oiode
Chapter 6: Designing Sequential Logic Circuits
6.1 Introduction
6.2 Static Sequential Circuits
6.2.1 Bistability
6.2.2 Flip-Flop Classification
6.2.3 Master-Slave and Edge-Triggered FFs
6.2.4 CMOS Static Flip-Flops
6.2.5 Bipolar Static Flip-Flops
6.3 Dynamic Sequentia) Circuits
6.3.1 The Pseudostatic Latch
6.3.2 The Dynamic Two-Phase Flip-Flop
6.3.3 The C2MOS Latch
6.3.4 NORA-CMOS-A Logic Style for Pipelined Structures
6.3.5 True Single-Phase Clocked Logic (TSPCL)
6.4 Non-Bistable Sequential Circuits
6.4.1 The Schmitt Trigger
6.4.2 Monostable Sequential Circuits
6.4.3 Astable Circuits
6.5 Perspective: Choosing a Clocking Strategy
6.6 Summary
6.7 To Probe Funher
6.8 Exercises and Design Problems
PART 11: A SYSTEMS PERSPECTIVE
Chapter 7: Designing Arithmetic Building Blocks
7.1 Introduction
7.2 Datapaths in Digital Processor Architectures
7.3 The Adder
7.3.1 The Binary Adder: Definitions
7.3.2 The Full Adder: Circuit Design Considerations
7.3.3 The Binary Adder: Logic Design Considerations
7.4 The Multiplier
7.4.1 The Multiplier: Definitions
7.4.2 The Array Multiplier
7.4.3 Other Multiplier Structures
7.5 The Shifter
7.5.1 BarrelShifter
7.5.2 Logarithmic Shifter
7.6 Other Arithmetic Operators
7.7 Power Considerations in Datapath Structures
7.7.1 Reducing the Supply Voltage
7.7.2 Reducing the Effective Capacitance
7.8 Perspective: De.sign as aTrade-off
7.9 Summary
7.10 To Probe Further
7.11 Exercises and Design Problems
Appendix E: From Datapath Schematics to Layout
Chapter 8: Coping wlth Interconnect
8.1 Introduction
8.2 Capacitive Parasitics
8.2.1 Modeling Interconnect Capacitance
8.2.2 Capacitance and Reliability-Cross Talk
8.2.3 Capacitance and Performance in CMOS
8.2.4 Capacitance and Performance in Bipolar Design
8.3 Resistive Parasitics
8.3.1 Modeling and Scaling of Interconnect Resistance
8.3.2 Resistance and Reliability-Ohmic Voltage Drop
8.3.3 Electromigration
8.3.4 Resistance and Performance-RC Delay
8.4 Inductive Parasitics
8.4.1 Sources of Parasitic Inductances
8.4.2 Inductance and Reliability- Voltage Drop
8.4.3 Inductance and Performance-Transmission Lin5e Effects
8.5 Comments on Packaging Technology
8.5.1 Package Materials
8.5.2 Interconnect Levels
8.5.3 Thennal Considerations in Packaging
8.6 Perspective: When to Consider Interconnect Parasitics
8.7 Chapter Summary
8.8 To Probe Further
8.9 Exercises and Design Problems
Chapter 9: Timing Issues in Digital Circuits
9.1 Introduction
9.2 Clock Skew and Sequential Circuit Performance
9.2.1 Single-Phase Edge-Triggered Clocking
9.2.2 Two-Phase Master-Slave Clocking
9.2.3 Other Clocking Styles
9.2.4 How to Counter Clock Skew Problems
9.2.5 Case Study-The Digital Alpha 21164 Microprocessor
9.3 Self-Timed Circuit Design*
9.3.1 Selt-Timed Concept
9.3.2 Completion-Signal Generation
9.3.3 Self-Timed Signaling
9.4 Synchronizers and Arbiters*
9.4.1 Synchronizers-Concept and Implementation
9.4.2 Arbiters
9.5 Clock Generation and Synchronization*
9.5.1 Clock Generators
9.5.2 Synchronization at the System Level
9.6 Perspective: Synchronous versus Asynchronous Design
9.7 Summary
9.8 To Probe Further
9.9 Exerci.ses and Design Problems
Chapter 10: Designing Memory and Array Structures
10.1 Introduction
10.2 Semiconductor Memories--An Introduction
10.2.1 Memory Classification
10.2.2 Memory Architectures and Building Blocks
10.3 The Memory Core
10.3.1 Read-Only Memories
10.3.2 Nonvolati le Read-Write Memories
10.3.3 Read-Write Memories (RAM)
10.4 Memory Peripheral Circuitry
10.4.1 The Address Decoders
10.4.2 Sense Amplifiers
10.4.3 Drivers/Buffers
10.4.4 Timing and Control
10.5 Memory Reliability and Yield
10.5.1 Signal-To-Noise Ratio
10.5.2 Memory yield
10.6 Case Studies in Memory Design
10.6.1 The Programmable Logic Array (PLA)
10.6.2 A 4 Mbit SRAM
10.7 Perspective: Semiconductor Memory Trends and Evolutions
10.8 Summary
10.9 To Probe Further
10.10 Exercises and Design Problems
Chapterll: Deslgn Methodologles
11.1 Introduction
11.2 Design Analysis and Simulation
11.2.1 Representing Digital Data as a Continuous Entity
11.2.2 Representing Data as a Discrete Entity
11.2.3 Using Higher-Level Data Models
11.3 Design Verification
11.3.1 Electrical Verification
11.3.2 Timing Verification
11.3.3 Functional (or Fonnal) Verification
11.4 Implementation Approaches
11.4.1 Custom Circuit Design
11.4.2 Cell-Based Design Methodology
11.4.3 Anay-Based Implementation Approaches
11.5 Design Synthesis
11.5.1 Circuit Synthesis
11.5.2 Logic Synthesis
11.5.3 Architecture Synthesis
11.6 Validation and Testing of Manufactured Circuits
11.6.1 TestProcedure
11.6.2 Design for Testability
11.6.3 Test-Pattem Generation
11.7 Perspective and Summary
11.8 To Probe Further
11.9 Exercises and Design Problems
Problem Solutions
· · · · · · (收起)
Chapterl: Introduction
1.1 A Historical Perspective
1.2 Issues in Digital Integrated Circuit Design
1.3 To Probe Further
1.4 Exercises
PART 1: A CIRCUIT PERSPECTIVE
Chapter 2: The Devices
2.1 Introduction
2.2 The Diode
2.2.1 A First Glance at the Device
2.2.2 Static Behavior
2.2.3 Dynamic, or Transient, Behavior
2.2.4 The Actual Diode-Secondary Effects
2.2.5 The SPICE Diode Model
2.3 The MOS(FET) Transistor
2.3.1 A First Glance at the Device
2.3.2 Static Behavior
2.3.3 Dynamic Behavior
2.3.4 The Actual MOS Transistor-Secondary Effects
2.3.5 SPICE Models for the MOS Transistor
2.4 The Bipolar Transistor
2.4.1 A First Glance at the Device
2.4.2 Stalic Behavior
2.4.3 Dynamic Behavior
2.4.4 The Actual Bipolar Transistor-Secondary Effects
2.4.5 SPICE Models for the Bipolar Transistor
2.5 A Word on Process Variations
2.6 Perspective: Future Device Developments
2.7 Summary
2.8 To Probe Further
2.9 Exercises and Design Problems
Appendlx A: Layout Design Rules
Appendlx B: Small-Slgnal Models
Chapter 3: The Inverter
3.1 Introduction
3.2 Delinitions and Properties
3.2.1 Area and Complexity
3.2.2 Functionality and Robustness: The Static Behavior
3.2.3 Performance: The Dynamic Behavior
3.2.4 Power and Energy Consumption
3.3 The Static CMOS Invener
3.3.1 A First Glance
3.3.2 Evaluating the Robustness of the CMOS Inverter: The Static Behavior
3.3.3 Perfonnance of CMOS Inverter: The Dynamic Behavior
3.3.4 Power Consumption and Power-Delay Product
3.3.5 A Look into the Future: Effects of Technology Scaling
3.4 The Bipolar ECL Inverter
3.4.1 Issues in Bipolar Digital Design: A Case Study
3.4.2 The Emitter-Coupled Logic (ECL) Gate at a Glance
3.4.3 Robustness and Noise Immunity: The Steady-State Characteristics
3.4.4 ECL Switching Speed: Thc Transient Behavior
3.4.5 Power Consumption
3.4.6 Looking Ahead: Scaling the Technology
3.5 Perspective: Area, Perfonnance, and Dissipation
3.6 Summary
3.7 To Probe Further
3.8 Exercises and Design Problems
Chapter 4: Designing Combinational Logk Cates in CMOS
4.1 Introduction
4.2 Static CMOS Design
4.2.1 Complementary CMOS
4.2.2 Ratioed Logic
4.2.3 Pass-Transistor Logic
4.3 Dynamic CMOS Design
4.3.1 Dynamic Logic: Basic Principles
4.3.2 Perfonnance of Dynamic Logic
4.3.3 Noise Considerations in Dynamic Design
4.3.4 Cascading Dynamic Gates
4.4 Power Consumption in CMOS Gates
4.4.1 Switching Activity of a Logic Gate
4.4.2 Glitching in Static CMOS Circuits
4.4.3 Short-Circuit Currents in Static CMOS Circuits
4.4.4 Analyzing Power Consumption Using SPICE
4.4.5 Low-Power CMOS Design
4.5 Perspective: How to Choose a Logic Style
4.6 Summary
4.7 To Probe Further
4.8 Exercises and Design Problems
Appendix C: Layout Techniques for Complex Cates
Chapter 5: Very High Perfonnance Digital Circuits
5.1 Introduction
5.2 Bipolar Gate Design
5.2.1 Logic Design in ECL
5.2.2 Differential ECL
5.2.3 Current Mode Logic
5:2.4 ECL with Active Pull-Downs
5.2.5 Altemative Bipolar Logic Styles
5.3 The BiCMOS Approach
5.3.1 The BiCMOS Gate at a Glance
5.3.2 The Static Behavior and Robustness Issues
5.3.3 Perfonnance of the BiCMOS Inverter
5.3.4 Power Consumption
5.3.5 Technology Scaling
5.3.6 Designing BiCMOS Digital Gates
5.4 Digital Gallium Arsenide Design *
5.4.1 GaAs Devices and Their Properties
5.4.2 GaAs Digital Circuit Design
5.5 Low-Temperature Digital Circuits *
5.5.1 Low-Temperature Silicon Digital Circuits
5.5.2 Superconducting Logic Circuits
5.6 Perspective: When to Use High-Performance Technologies
5.7 Summary
5.8 To Probe Further
5.9 Exercises and Design Problems
Appendlx D: The Schottky-Bamer Oiode
Chapter 6: Designing Sequential Logic Circuits
6.1 Introduction
6.2 Static Sequential Circuits
6.2.1 Bistability
6.2.2 Flip-Flop Classification
6.2.3 Master-Slave and Edge-Triggered FFs
6.2.4 CMOS Static Flip-Flops
6.2.5 Bipolar Static Flip-Flops
6.3 Dynamic Sequentia) Circuits
6.3.1 The Pseudostatic Latch
6.3.2 The Dynamic Two-Phase Flip-Flop
6.3.3 The C2MOS Latch
6.3.4 NORA-CMOS-A Logic Style for Pipelined Structures
6.3.5 True Single-Phase Clocked Logic (TSPCL)
6.4 Non-Bistable Sequential Circuits
6.4.1 The Schmitt Trigger
6.4.2 Monostable Sequential Circuits
6.4.3 Astable Circuits
6.5 Perspective: Choosing a Clocking Strategy
6.6 Summary
6.7 To Probe Funher
6.8 Exercises and Design Problems
PART 11: A SYSTEMS PERSPECTIVE
Chapter 7: Designing Arithmetic Building Blocks
7.1 Introduction
7.2 Datapaths in Digital Processor Architectures
7.3 The Adder
7.3.1 The Binary Adder: Definitions
7.3.2 The Full Adder: Circuit Design Considerations
7.3.3 The Binary Adder: Logic Design Considerations
7.4 The Multiplier
7.4.1 The Multiplier: Definitions
7.4.2 The Array Multiplier
7.4.3 Other Multiplier Structures
7.5 The Shifter
7.5.1 BarrelShifter
7.5.2 Logarithmic Shifter
7.6 Other Arithmetic Operators
7.7 Power Considerations in Datapath Structures
7.7.1 Reducing the Supply Voltage
7.7.2 Reducing the Effective Capacitance
7.8 Perspective: De.sign as aTrade-off
7.9 Summary
7.10 To Probe Further
7.11 Exercises and Design Problems
Appendix E: From Datapath Schematics to Layout
Chapter 8: Coping wlth Interconnect
8.1 Introduction
8.2 Capacitive Parasitics
8.2.1 Modeling Interconnect Capacitance
8.2.2 Capacitance and Reliability-Cross Talk
8.2.3 Capacitance and Performance in CMOS
8.2.4 Capacitance and Performance in Bipolar Design
8.3 Resistive Parasitics
8.3.1 Modeling and Scaling of Interconnect Resistance
8.3.2 Resistance and Reliability-Ohmic Voltage Drop
8.3.3 Electromigration
8.3.4 Resistance and Performance-RC Delay
8.4 Inductive Parasitics
8.4.1 Sources of Parasitic Inductances
8.4.2 Inductance and Reliability- Voltage Drop
8.4.3 Inductance and Performance-Transmission Lin5e Effects
8.5 Comments on Packaging Technology
8.5.1 Package Materials
8.5.2 Interconnect Levels
8.5.3 Thennal Considerations in Packaging
8.6 Perspective: When to Consider Interconnect Parasitics
8.7 Chapter Summary
8.8 To Probe Further
8.9 Exercises and Design Problems
Chapter 9: Timing Issues in Digital Circuits
9.1 Introduction
9.2 Clock Skew and Sequential Circuit Performance
9.2.1 Single-Phase Edge-Triggered Clocking
9.2.2 Two-Phase Master-Slave Clocking
9.2.3 Other Clocking Styles
9.2.4 How to Counter Clock Skew Problems
9.2.5 Case Study-The Digital Alpha 21164 Microprocessor
9.3 Self-Timed Circuit Design*
9.3.1 Selt-Timed Concept
9.3.2 Completion-Signal Generation
9.3.3 Self-Timed Signaling
9.4 Synchronizers and Arbiters*
9.4.1 Synchronizers-Concept and Implementation
9.4.2 Arbiters
9.5 Clock Generation and Synchronization*
9.5.1 Clock Generators
9.5.2 Synchronization at the System Level
9.6 Perspective: Synchronous versus Asynchronous Design
9.7 Summary
9.8 To Probe Further
9.9 Exerci.ses and Design Problems
Chapter 10: Designing Memory and Array Structures
10.1 Introduction
10.2 Semiconductor Memories--An Introduction
10.2.1 Memory Classification
10.2.2 Memory Architectures and Building Blocks
10.3 The Memory Core
10.3.1 Read-Only Memories
10.3.2 Nonvolati le Read-Write Memories
10.3.3 Read-Write Memories (RAM)
10.4 Memory Peripheral Circuitry
10.4.1 The Address Decoders
10.4.2 Sense Amplifiers
10.4.3 Drivers/Buffers
10.4.4 Timing and Control
10.5 Memory Reliability and Yield
10.5.1 Signal-To-Noise Ratio
10.5.2 Memory yield
10.6 Case Studies in Memory Design
10.6.1 The Programmable Logic Array (PLA)
10.6.2 A 4 Mbit SRAM
10.7 Perspective: Semiconductor Memory Trends and Evolutions
10.8 Summary
10.9 To Probe Further
10.10 Exercises and Design Problems
Chapterll: Deslgn Methodologles
11.1 Introduction
11.2 Design Analysis and Simulation
11.2.1 Representing Digital Data as a Continuous Entity
11.2.2 Representing Data as a Discrete Entity
11.2.3 Using Higher-Level Data Models
11.3 Design Verification
11.3.1 Electrical Verification
11.3.2 Timing Verification
11.3.3 Functional (or Fonnal) Verification
11.4 Implementation Approaches
11.4.1 Custom Circuit Design
11.4.2 Cell-Based Design Methodology
11.4.3 Anay-Based Implementation Approaches
11.5 Design Synthesis
11.5.1 Circuit Synthesis
11.5.2 Logic Synthesis
11.5.3 Architecture Synthesis
11.6 Validation and Testing of Manufactured Circuits
11.6.1 TestProcedure
11.6.2 Design for Testability
11.6.3 Test-Pattem Generation
11.7 Perspective and Summary
11.8 To Probe Further
11.9 Exercises and Design Problems
Problem Solutions
· · · · · · (收起)
读后感
要读这本书，我觉得得要有三个前提。第一：不急躁的心态，第二：有层次想当的人可以讨论；第三：比较深厚的数字电路的基础。这可能是由于国外的教学方式与国内的教学方式不同，所以造成了国外教材在国内并不被很多学生所接受的原因之一。国外是一种讨论式、引导式的教学方式，...
要读这本书，我觉得得要有三个前提。第一：不急躁的心态，第二：有层次想当的人可以讨论；第三：比较深厚的数字电路的基础。这可能是由于国外的教学方式与国内的教学方式不同，所以造成了国外教材在国内并不被很多学生所接受的原因之一。国外是一种讨论式、引导式的教学方式，...
要读这本书，我觉得得要有三个前提。第一：不急躁的心态，第二：有层次想当的人可以讨论；第三：比较深厚的数字电路的基础。这可能是由于国外的教学方式与国内的教学方式不同，所以造成了国外教材在国内并不被很多学生所接受的原因之一。国外是一种讨论式、引导式的教学方式，...
要读这本书，我觉得得要有三个前提。第一：不急躁的心态，第二：有层次想当的人可以讨论；第三：比较深厚的数字电路的基础。这可能是由于国外的教学方式与国内的教学方式不同，所以造成了国外教材在国内并不被很多学生所接受的原因之一。国外是一种讨论式、引导式的教学方式，...
要读这本书，我觉得得要有三个前提。第一：不急躁的心态，第二：有层次想当的人可以讨论；第三：比较深厚的数字电路的基础。这可能是由于国外的教学方式与国内的教学方式不同，所以造成了国外教材在国内并不被很多学生所接受的原因之一。国外是一种讨论式、引导式的教学方式，...
用户评价
我特别关注了书中对于现代EDA工具流程的介绍，这是我非常看重的一个环节，毕竟现代IC设计已经完全离不开自动化工具链。然而，这本书在这部分的内容更新明显滞后了。它描述的流程和工具链仿佛还停留在十年前的水平，对于目前主流的布局布线、静态时序分析（STA）以及形式验证等环节的最新发展趋势几乎没有提及。对于如何利用先进的PPA（性能、功耗、面积）优化算法，以及如何应对先进工艺节点带来的设计挑战，书中的论述显得力不从心。对于希望通过这本书来跟上行业前沿的读者来说，这无疑是一个巨大的缺陷。一本关于“设计”的书，如果不能反映当前行业的主流实践和最新技术栈，其时效性和指导价值就会大打折扣。
这本书的作者的语言风格非常严谨，这本身是优点，但在这里却成了阻碍。他似乎对“精确”二字有着近乎偏执的追求，导致行文逻辑非常复杂，句子结构冗长且充满了各种从句和限定词。阅读过程中，我需要反复回溯前面的内容，才能确认某一个限定条件到底作用于哪个参数。这种“学术化”的表达方式，虽然保证了定义的严密性，却极大地降低了信息传递的效率。我感觉我不是在学习设计知识，而是在破解一道复杂的语言谜题。一个好的技术书籍应该像一个耐心的导师，引导你清晰地理解概念，而不是像一份冗长晦涩的法律文件，需要专业的“翻译”才能被理解。这种表达上的障碍，使得很多本应直观的知识点变得难以消化。
拿到这本书时，我满怀期待，希望它能为我打开数字电路设计领域的一扇新窗。然而，读完后我却感到有些失落。这本书的叙述方式过于抽象，仿佛在试图用数学公式构建起整个世界，却忽略了实际工程中的“人”的体验。它花了大量篇幅讲解各种抽象的模型和理论推导，这些内容固然重要，但对于一个初学者或者希望快速应用知识的工程师来说，显得有些晦涩难懂。书中缺乏生动的案例分析，很多时候我需要跳出书本，去外部资源搜索相关的实际应用场景，才能真正理解书中所述概念的意义。如果作者能在理论和实践之间搭建更坚实的桥梁，比如多引用一些行业内的经典设计案例，或者提供更贴近实际的仿真结果，这本书的价值会大大提升。目前的版本更像是一本理论参考手册，而不是一本可以引导实践的“透视”之作。我希望下一版能更注重“设计”的“透视”感，少一些纯粹的公式堆砌。
这本书的排版和插图设计实在让人不敢恭维，这对于一本旨在“透视”复杂电路的书来说，是一个致命的伤。很多关键的电路图看起来模糊不清，线条交叉在一起，让人眼花缭乱，根本无法清晰地分辨信号流向和逻辑关系。更别提那些试图解释复杂概念的示意图了，它们往往过于简化，甚至在某些关键点上存在误导性。阅读体验非常糟糕，我不得不频繁地放大、调整屏幕亮度，才能勉强跟上作者的思路。在数字集成电路这个领域，视觉化的辅助至关重要，它能帮助我们直观地理解时间延迟、功耗分布和面积优化这些核心问题。遗憾的是，这本书在这方面做得非常不到位，让人感觉像是拿着一本早期的技术文档在阅读，而不是一本面向现代工程师的专业书籍。如果能投入更多资源进行高质量的图形设计和排版优化，这本书的阅读体验和知识吸收效率都会有质的飞跃。
关于这本书的深度，我持保留态度。它似乎在试图覆盖太多的主题，结果导致每个部分都只是蜻蜓点水，没有真正深入到核心的“设计透视”层面。从CMOS器件原理讲起，到逻辑门设计，再到系统级架构，所有内容都浅尝辄止。例如，在谈及亚阈值功耗管理时，书中只是简单罗列了几种方法，却完全没有探讨不同工艺节点下各种方法的权衡取舍（Trade-offs），比如在速度、面积和泄漏电流之间的动态平衡。对于一个有经验的工程师而言，这些权衡才是设计真正的精髓所在。这本书更像是对现有知识点的快速回顾，而不是提供一种全新的、更深刻的洞察视角。它缺少那种“原来如此！”的顿悟时刻，总觉得总在门外徘徊，无法真正窥见设计背后的深层逻辑和关键决策点。
研究生读过的书。。。。
有讲到完整的电路设计流程，清华教材之一
有讲到完整的电路设计流程，清华教材之一
研究生读过的书。。。。
有讲到完整的电路设计流程，清华教材之一
